IMPROVEMENT OF THERMAL COMPENSATION CIRCUIT FOR PIEZORESISTIVE PRESSURE SENSORS 

Stanislav G. Sementsov, Doctor of technical sciences, associate professor, professor of the sub-department of design and production technology of the electronic equipment, Bauman Moscow State Technical University (5 2-ya Baumanskaya street, Moscow, Russia), E-mail: siemens_off@mail.ru
Arina A. Adamova, Candidate of technical sciences, associate professor, associate professor of the sub-department of design and production technology of the electronic equipment, Bauman Moscow State Technical University (5 2-ya Baumanskaya street, Moscow, Russia), E-mail: aadamova@bmstu.ru 

Background. The article discusses integrated piezoresistive converters based on monocrystalline silicon. The operation of the built-in thermal compensation circuit with additional thermistors and the features of its operation are analyzed. Materials and methods. The applicability of thermistors with positive and negative temperature coefficients of resistance to improve the parameters of the thermal compensation circuit is considered. Results and conclusions. Circuit modeling of an improved thermal compensation circuit was carried out over a wide temperature range. The advantages of an improved thermal compensation circuit are shown. 

temperature error, measuring bridge, piezoresistive converter, monocrystalline silicon, ICPintegrated pressure converter 

Sementsov S.G., Adamova A.A. Improvement of thermal compensation circuit for piezoresistive pressure sensors. Nadezhnost' i kachestvo slozhnykh sistem = Reliability and quality of complex systems. 2024;(2):52–58. (In Russ.). doi: 10.21685/2307-4205-2024-2-5